The Defense Logistics Agency (DLA) has awarded Cobham’s Semiconductor Solutions Colorado Springs, Colo., facility its first MIL-PRF-38535 Class Y assembly certification. The Class Y designation was granted for the use of ceramic non-hermetic packages for space applications. The Class Y designation allows for the use of non-hermetic flip-chip packaging technology. Cobham’s Colorado Spring facility, formerly known as Aeroflex, has now been certified for Class Y flip-chip device assembly, as the result of an August 2014 DLA audit to Revision K, and the Class Y requirements described therein.

As Rafi Albarian, senior vice president and general manager for Cobham Semiconductor, said, “We are proud to be the first company to attain this status, all in the name of better serving our customers.” Dr. Scott Popelar, manager of the Cobham Advanced Packaging Engineering group, added, “Attaining Class Y assembly certification is a major step toward Cobham offering its customers ASIC products in a flip chip, non-hermetic package format, and keeps Cobham at the industry forefront of Class Y technology development and productization.”